Telefonaktiebolaget Lm Ericsson (Publ)

Neng Liu

Robert Frank Brunner

Stephane Lessard

A chip carrier socket for an electronic-photonic integrated-circuit (EPIC) assembly comprises a carrier bottom and a carrier top configured to mate to the carrier bottom while enclosing the EPIC assembly within an enclosed cavity. The carrier bottom comprises one or more conductive vias passing from a first surface of the carrier bottom to an opposite second surface of the carrier bottom, each conductive via providing electrical connectivity between an electrically conductive pad on the first surface of the carrier bottom and a respective electrically conductive pad, solder ball, or electrically conductive spring on the second surface of the carrier bottom. One or both of the carrier bottom and the carrier top comprises a fluid inlet port and a fluid outlet port. Further, either or both of the carrier bottom and the bottom top comprises an optical via passing from one surface to another of the carrier bottom or carrier top.

Chip-carrier socket for microfluidic-cooled three-dimensional electronic/photonic integrated circuits

A radio-frequency three-dimensional electronic-photonic integrated circuit (RF 3D EPIC) comprises a radio-frequency (RF) photonic integrated circuit (PIC) layer, the RF PIC layer comprising, in a single integrated circuit, at least one RF antenna and at least one photonic device coupling the RF antenna to an optical interface, and further comprises an electronic-photonic integrated circuit (EPIC) assembly optically coupled to the optical interface of the RF PIC layer, the EPIC assembly comprising two or more integrated-circuit dies bonded to one another so as to form a die stack, wherein at least one of the two or more integrated-circuit dies comprises one or more integrated photonic devices and wherein each of the two or more integrated-circuit dies is electrically connected to at least one other integrated-circuit die via an electrically conductive through-wafer interconnect or an electrically conductive through-wafer via.

Radio-frequency three-dimensional electronic-photonic integrated circuit with integrated antennas and transceivers

According to an aspect, an optical system includes a laser diode configured to emit optical signals and at least two size-switchable broken racetrack ring resonators optically coupled to an optical waveguide, where each broken racetrack ring resonator is configured to exhibit a resonant wavelength. The optical system also includes a tuning arrangement associated with the broken racetrack ring resonators, where the tuning arrangement includes a micro electro-mechanical system (MEMS) or nano electro-mechanical system (NEMS) actuator mechanically coupled to a first portion of a first one of the broken racetrack ring resonators and configured to mechanically move the first portion so as to change the resonant wavelength of the first one of the broken racetrack ring resonators.

MEMS/NEMS integrated broken racetrack tunable laser diode

An electronic-photonic integrated-circuit assembly comprises a carrier substrate () and one or more integrated-circuit dies () bonded to one another so as to form a die stack with exterior surfaces corresponding to an outer surface of a first one of the integrated-circuit dies and to an outer surface of a second one of the integrated-circuit dies, where at least one of the integrated-circuit dies includes one or more integrated photonic devices. One or more channels or passages () are formed into the outer surface of the first one of the integrated-circuit dies, and a first surface of the carrier substrate () is bonded to the outer surface of the first one of the integrated-circuit dies, thereby enclosing the one or more channels or passages (), The integrated-circuit dies are electrically connected to each other via electrically conductive through-wafer interconnects or electrically conductive through-wafer vias.

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Montreal, Canada

Neng Liu