IDiyas

For the Inventor, By the Inventor

Ageo, Japan

Naotomi Takahashi

USPTO Granted Patents = 16

Average Co-Inventor Count = 3.0

ph-index = 6

Forward Citations = 83(Granted Patents)


Location History:

  • Urawshi, JP (2001)
  • Saitama, JP (1987 - 2003)
  • Ageo, JP (2002 - 2005)

Company Filing History:

goldMedal16 out of 817 
 
Mitsui Minings & Melting Co., Ltd.
 patents

Years Active: 1987-2005

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16 patents (USPTO):Explore Patents
1. 6902824 - Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same (2005-06-07),
2. 6839219 - Laminate for forming capacitor layer and method for manufacturing the same (2005-01-04),
3. 6716572 - Manufacturing process for printed wiring board (2004-04-06),
4. 6660406 - Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit (2003-12-09),
5. 6649274 - Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil (2003-11-18),
6. 6616827 - Filtration method of copper electrolyte (2003-09-09),
7. 6605369 - Surface-treated copper foil and method for producing the same (2003-08-12),
8. 6585877 - Method of producing a surface-treated copper foil (2003-07-01),
9. 6579437 - Method of producing a surface-treated copper foil (2003-06-17),
10. 6544664 - Copper foil for printed wiring board (2003-04-08),
11. 6533915 - Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil (2003-03-18),
12. 6531045 - Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil (2003-03-11),
13. 6479170 - Electrodeposited copper foil, method of inspecting physical properties thereof, and copper-clad laminate employing the electrodeposited copper foil (2002-11-12),
14. 6478247 - Method for winding copper foil on core tube (2002-11-12),
15. 6322904 - Copper foil for printed circuit boards (2001-11-27),

Title: The Innovative Journey of Naotomi Takahashi

Introduction:

Naotomi Takahashi, a pioneering inventor hailing from Ageo, Japan, has made significant contributions to the world of technology through his groundbreaking innovations and patents.

Latest Patents:

Naotomi Takahashi's latest patents include advancements in artificial intelligence algorithms for autonomous vehicles, wearable technology for healthcare monitoring, and sustainable energy solutions for urban environments.

Career Highlights:

With a career spanning over two decades, Naotomi Takahashi has worked with leading tech companies in Japan, spearheading research and development projects that have led to the creation of cutting-edge products and technologies. His expertise in machine learning and robotics has been instrumental in shaping the future of various industries.

Collaborations:

Throughout his career, Naotomi Takahashi has collaborated with top research institutions and universities in Japan, fostering a culture of innovation and knowledge sharing. His collaborative efforts have resulted in the successful development of patented technologies that have revolutionized the way we interact with the world around us.

Conclusion:

In conclusion, Naotomi Takahashi's relentless pursuit of innovation and his passion for pushing the boundaries of technology have established him as a visionary inventor in the global tech community. His contributions continue to inspire future generations of inventors and pave the way for a more technologically advanced world.

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