The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2005
Filed:
Jan. 31, 2002
Takuya Yamamoto, Ageo, JP;
Takashi Kataoka, Ageo, JP;
Yutaka Hirasawa, Ageo, JP;
Naotomi Takahashi, Ageo, JP;
Takuya Yamamoto, Ageo, JP;
Takashi Kataoka, Ageo, JP;
Yutaka Hirasawa, Ageo, JP;
Naotomi Takahashi, Ageo, JP;
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Abstract
This invention provides a metal foil and an etching process which overcomes the problem of etching of the copper foil layer and the plating copper layer formed on a metal clad laminate during the conventional semi-additive process for producing printed wire boards. In the present invention, the metal foil and the metal foil with carrier foil include a nickel or tin layer 0.5 to 3 μm thick formed on the external surface of a metal clad laminate which protects the surface of the plated layer during the final flash etching of the copper foil layer.