Ageo, Japan

Takashi Kataoka


Average Co-Inventor Count = 3.4

ph-index = 5

Forward Citations = 82(Granted Patents)


Location History:

  • Saitama, JP (2001)
  • Ageo, JP (2001 - 2005)

Company Filing History:


Years Active: 2001-2005

Loading Chart...
14 patents (USPTO):Explore Patents

Title: Innovations by Takashi Kataoka: Pioneering Advances in Copper Foil Technology

Introduction

Takashi Kataoka, an inventive mind based in Ageo, Japan, has made significant contributions to the field of materials science with a strong focus on copper foil technology. With a total of 14 patents to his name, Kataoka's work primarily revolves around innovations that enhance the efficiency and performance of printed wiring boards.

Latest Patents

Among his latest patents is a groundbreaking invention titled "Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the same." This invention features a surface-treated copper foil that ensures adhesive strength with low-dielectric substrates used in high-frequency printed wiring boards while minimizing transmission losses. The technology involves a nodular-treated layer of bump-like copper particles, with ultrafine copper particles precipitated on the surface, achieving a roughness value Rz between 1.0 to 6.5 μm. The unique surface coloration is defined by specific L*, a*, and b* values that optimize its performance.

Another notable patent is focused on a "metal foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same." This innovation addresses the challenges in etching copper foil layers during the semi-additive process for printed wiring boards. It incorporates a nickel or tin layer that protects the surface during the final flash etching, demonstrating Kataoka's commitment to enhancing manufacturing processes.

Career Highlights

Kataoka is associated with Mitsui Mining & Smelting Company, Ltd., where he continues to push the boundaries of research in materials relevant to electronics. His innovations are critical to advancing the production techniques and performance attributes of electronic components.

Collaborations

Throughout his career, Kataoka has collaborated closely with talented colleagues, including Takuya Yamamoto and Naotomi Takahashi. These partnerships have fostered a collaborative environment that encourages innovative thinking and problem-solving in the complex field of materials science.

Conclusion

Takashi Kataoka stands out as a prominent inventor whose contributions to copper foil technology are shaping the future of printed circuitry. His dedication to innovation and collaboration not only enhances his company's offerings but also propels advancements in the electronics industry at large. His portfolio continues to inspire the next generation of inventors and researchers in the field.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…