The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2003
Filed:
Jun. 20, 2001
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Abstract
There are provided an electrodeposited copper foil with carrier that can be used for manufacturing a printed wiring board that excels in the finished accuracy of the resistor circuit in comparison with a conventional printed wiring board with resistor circuits, and a method for manufacturing such a printed wiring board with resistor circuits. The method for manufacturing a printed wiring board with resistor circuits comprises the steps of previously forming copper foil circuits using a copper foil for a printed wiring board with resistor circuits comprising a nickel layer for forming a resistor circuit between a copper carrier and a copper foil layer for forming the circuit, whose surface layer is subjected to a nodular treatment, using a copper etching solution that does not etch the nickel layer; fabricating a copper clad laminate using the copper foil after forming the copper circuits, and a prepreg composing a resin base material; removing the copper carrier to expose the nickel layer for forming the resistor circuit, and etching the resistor circuits to form the nickel resistor-circuits.