The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2003
Filed:
May. 24, 2000
Naotomi Takahashi, Saitama, JP;
Yoichi Babasaki, Saitama, JP;
Tsutomu Higuchi, Saitama, JP;
Osamu Nakano, Saitama, JP;
Hiroshi Watanabe, Saitama, JP;
Masaru Takahashi, Saitama, JP;
Makoto Dobashi, Saitama, JP;
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Abstract
A copper foil for use in making a printed wiring board and a copper clad laminate comprising the copper foil are herein disclosed and the copper foil is characterized in that a metal chromium layer is formed on at least one side of the copper foil by vapor deposition or characterized in that one side of the copper foil is supported by a carrier through a releasing layer and a metal chromium layer is formed on the other side of the foil by vapor deposition. The copper foil is excellent in the adhesion to various substrates (the peel strength between the substrate and the copper foil), moisture resistance, chemical resistance and heat resistance and therefore, the copper foil can suitably be used in the production of printed wiring boards.