Hiroshi Watanabe is a prominent inventor based in Ageo, Japan. He has made significant contributions to the field of materials science, particularly in the development of advanced copper foil technologies. With a total of 6 patents to his name, Watanabe's work has had a substantial impact on the manufacturing processes of printed wiring boards.

Latest Patents

One of Watanabe's latest patents focuses on a surface-treated copper foil. The objective of this invention is to provide a surface-treated copper foil that is free from chromium in the surface-treatment layer while exhibiting excellent peel strength and chemical resistance. This innovation is crucial for maintaining the integrity of printed wiring boards during processing. The surface-treated copper foil features a treatment layer formed by depositing a high melting point metal component, not lower than 1400°C, using a dry process film formation method.

Another notable patent involves a copper foil with a carrier sheet. This invention aims to allow the easy release of the carrier sheet from the copper foil layer, even when subjected to hot pressing at temperatures exceeding 300°C. The copper foil with a physically releasable carrier sheet includes a bonding interface layer composed of a metal layer and a carbon layer, enhancing its performance in printed wiring board production.

Career Highlights

Hiroshi Watanabe is currently employed at Mitsui Mining & Smelting Company, Ltd., where he continues to innovate in the field of copper foil technology. His work has been instrumental in advancing the capabilities of materials used in electronic applications.

Collaborations

Watanabe has collaborated with notable colleagues such as Seiichiro Takahashi and Seiji Nagatani. Their combined expertise has contributed to the successful development of various technologies in the industry.

Conclusion

Hiroshi Watanabe's contributions to copper foil technology exemplify the importance of innovation in materials science. His patents reflect a commitment to enhancing the performance and reliability of electronic components. Through his work, Watanabe continues to shape the future of manufacturing in this critical field.

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