Mitsui Minings & Melting Co., Ltd.

Hiroshi Watanabe

Seiji Nagatani

Seiichiro Takahashi

Kazufumi Izumida

Makoto Dobashi

Naotomi Takahashi

Tsutomu Higuchi

Takashi Kubota

Masaru Takahashi

Makoto Ikeda

Osamu Nakano

Yoichi Babasaki

Object is to provide a surface-treated copper foil free from chromium in the surface-treatment layer and excellent in peel strength of a circuit and chemical resistance against to degradation of the peel strength after processing into a printed wiring board. To achieve the object, the surface-treated copper foil having a surface-treatment layer on a bonding surface of a copper foil for manufacturing a copper-clad laminate by laminating it to an insulating resin substrate has the surface-treatment layer formed by depositing a metal component having high melting point not lower than 1400&#xb0; C. by dry process film formation method to the bonding surface of the copper foil after the cleaning treatment and further depositing a carbon component to the surface.

Surface-treated copper foil

An object of the present invention is to provide a copper foil with carrier sheet which permits releasing of the carrier sheet from the copper foil layer even when hot pressing at a temperature exceeding 300&#xb0; C. is applied in the production of a printed wiring board. In order to achieve the object, a copper foil with physically releasable carrier sheet having a copper foil layer on the surface of the carrier sheet through a bonding interface layer, characterized in that the bonding interface layer is composed of a metal layer and a carbon layer. It is preferable for the bonding interface layer to be composed of a metal layer of 1 nm to 50 nm thick and a carbon layer of 1 nm to 20 nm thick.

Copper foil with carrier sheet, method for manufacturing copper foil with carrier sheet, and surface-treated copper foil with carrier sheet

The invention provides an indium oxide-tin oxide powder which can be produced at low cost and which can provide a high-density sputtering target having a prolonged target life, and a sputtering target employing the powder. The indium oxide-tin oxide powder containing an In&#x2014;Sn oxide as a predominant component is characterized in that the oxide powder contains no compound oxide (InSnO) detectable through X-ray diffraction and has a SnOsolid solution amount in InOof 2.3 mass % or more, the SnOsolid solution amount being calculated from the precipitated SnOcontent (mass %) obtained from the ratio between integral diffraction intensity attributed to InO(222) and integral diffraction intensity attributed to SnO(110).

Indium oxide-tin oxide powder and sputtering target using the same

The present invention provides an ITO sputtering target for forming a high-resistance transparent conductive film which target can be used virtually in a DC magnetron sputtering apparatus and can form a high-resistance, transparent film, and a method for producing a high-resistance transparent conductive film. The sputtering target for forming a high-resistance transparent conductive film having a resistivity of about (0.8&#x2013;10)&#xd7;10&#x3a9;cm contains indium oxide, an insulating oxide, and optionally tin oxide.

Sputtering target for forming high-resistance transparent conductive film, and method for producing the film

Aluminum alloy thin film target material and method for forming thin film using the same

A copper foil for use in making a printed wiring board and a copper clad laminate comprising the copper foil are herein disclosed and the copper foil is characterized in that a metal chromium layer is formed on at least one side of the copper foil by vapor deposition or characterized in that one side of the copper foil is supported by a carrier through a releasing layer and a metal chromium layer is formed on the other side of the foil by vapor deposition. The copper foil is excellent in the adhesion to various substrates (the peel strength between the substrate and the copper foil), moisture resistance, chemical resistance and heat resistance and therefore, the copper foil can suitably be used in the production of printed wiring boards.

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Ageo, Japan

Hiroshi Watanabe