This inventor holds 2 USPTO granted patents. Top assignee: Mitsui Minings & Melting Co., Ltd.. Active years: 2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Ageo, JP (2003)
- Saitama, JP (2003)
Company Filing History:
Years Active: 2003
Title: Osamu Nakano: Innovator in Copper Foil Technology
Introduction
Osamu Nakano is a prominent inventor based in Saitama, Japan. He has made significant contributions to the field of materials science, particularly in the development of advanced copper foil technologies. With a total of 2 patents to his name, Nakano's work has had a substantial impact on the electronics industry.
Latest Patents
One of Nakano's latest patents is for an electrodeposited copper foil. The objective of this invention is to provide a copper foil that exhibits excellent adhesion to an etching resist layer without the need for physical polishing during the pre-treatment of the etching process. This is achieved by employing a titanium material with a grain size number of 6.0 or more as the copper deposition surface of the rotating drum cathode. Additionally, glue and/or gelatin is added to a copper sulfate solution, resulting in a drum foil that enhances the quality of the electrodeposited copper foil. This foil is particularly useful for producing copper-clad laminates.
Another significant patent by Nakano involves a copper foil designed for printed wiring boards. This copper foil is characterized by a metal chromium layer formed on at least one side through vapor deposition. The foil demonstrates excellent adhesion to various substrates, as well as moisture, chemical, and heat resistance. These properties make it highly suitable for the production of printed wiring boards.
Career Highlights
Osamu Nakano is currently employed at Mitsui Mining & Smelting Company, Ltd., where he continues to innovate in the field of copper foil technology. His work has been instrumental in advancing the capabilities of materials used in electronic applications.
Collaborations
Throughout his career, Nakano has collaborated with notable colleagues, including Naotomi Takahashi and Yoichi Babasaki. These partnerships have contributed to the successful development of his patented technologies.
Conclusion
Osamu Nakano's contributions to copper foil technology have established him as a key figure in the field. His innovative patents reflect a commitment to enhancing the performance and reliability of materials used in electronics.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile