Company Filing History:
Years Active: 2003-2021
Title: Naoki Omiya: Innovator in Wafer Production Technology
Introduction
Naoki Omiya is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the production of silicon carbide (SiC) wafers. With a total of 5 patents to his name, Omiya's work has advanced the technology used in wafer production.
Latest Patents
Omiya's latest patents include innovative wafer producing apparatuses designed to enhance the efficiency and quality of SiC wafer production. One of his notable inventions involves a system that produces a SiC wafer from a single crystal SiC ingot. This apparatus features a holding unit for the ingot, a flattening unit for grinding the ingot's upper surface, and a laser applying unit that sets the focal point of a laser beam at a predetermined depth. This depth corresponds to the thickness of the wafer to be produced, allowing for the formation of a separation layer that facilitates the wafer's detachment from the ingot. Another patent describes a similar wafer producing apparatus that includes an ingot grinding unit, a laser applying unit, and a wafer peeling unit, all designed to streamline the production process.
Career Highlights
Naoki Omiya is currently employed at Disco Corporation, where he continues to innovate in the field of semiconductor technology. His work has not only contributed to the advancement of wafer production but has also positioned Disco Corporation as a leader in the industry.
Collaborations
Omiya collaborates with talented coworkers such as Kentaro Iizuka and Takashi Mori. Their combined expertise fosters a creative environment that drives innovation within the company.
Conclusion
Naoki Omiya's contributions to wafer production technology exemplify the impact of innovative thinking in the semiconductor industry. His patents reflect a commitment to enhancing manufacturing processes and improving product quality.