Naoki Kanagawa is a prominent inventor based in Mie, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on encapsulation resin compositions and thermosetting materials that enhance the performance and reliability of semiconductor devices.

Latest Patents

Kanagawa's latest patents include an encapsulation resin composition designed to hermetically seal the gap between a base member and a semiconductor chip. This composition has a reaction start temperature of 160°C or less and a melt viscosity of 200 Pa·s or less at the reaction start temperature. Additionally, he has developed a thermosetting composition for use as an underfill material, which contains a mono- or bifunctional acrylic compound, a thermo-radical polymerization initiator, silica, and an elastomer with a 1,2-vinyl group. This composition is liquid and cures to a product with a relative dielectric constant of 3.2 or less at 25°C.

Career Highlights

Kanagawa is currently employed at Panasonic Intellectual Property Management Co., Ltd., where he continues to innovate in the semiconductor field. His work has been instrumental in advancing the technology used in modern electronic devices.

Collaborations

He has collaborated with notable coworkers such as Shigeru Yamatsu and Kazuki Watanabe, contributing to the development of cutting-edge semiconductor technologies.

Conclusion

Naoki Kanagawa's contributions to semiconductor technology through his innovative patents and collaborations highlight his importance in the field. His work continues to influence the development of reliable and efficient electronic devices.

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