logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10797013 B1

PDFFull Text
Date of Patent:
Oct. 06, 2020

Filed:

Jan. 19, 2016

Acrylic resin composition for sealing, cured product of same, method for producing same, semiconductor device using said resin composition, and method for manufacturing said semiconductor device

Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Jin Jin, Osaka, JP;

Naoki Kanagawa, Nara, JP;

Shigeru Yamatsu, Osaka, JP;

Daisuke Sasaki, Osaka, JP;

Kazuki Watanabe, Osaka, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

David T Karst

Int. Cl.
CPC ...
H01L 23/00 (2006.01); C08L 33/06 (2006.01); C09D 133/06 (2006.01); C08K 9/06 (2006.01); H01L 21/56 (2006.01); C08K 3/22 (2006.01); C08K 5/14 (2006.01); C08K 5/5435 (2006.01); C08L 33/08 (2006.01); C08L 63/00 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); C08K 3/013 (2018.01); C08L 33/10 (2006.01); C08K 3/28 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); C08K 3/22 (2013.01); C08K 5/14 (2013.01); C08K 5/5435 (2013.01); C08K 9/06 (2013.01); C08L 33/06 (2013.01); C08L 33/08 (2013.01); C08L 33/10 (2013.01); C08L 63/00 (2013.01); C09D 133/06 (2013.01); H01L 21/4853 (2013.01); H01L 21/50 (2013.01); H01L 21/563 (2013.01); C08K 3/013 (2018.01); C08K 2003/222 (2013.01); C08K 2003/2217 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/282 (2013.01); C08K 2201/005 (2013.01); H01L 2021/60232 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81 (2013.01); H01L 2224/83192 (2013.01);
Abstract

A sealing acrylic resin composition contains a thermosetting acrylic resin in liquid phase, an organic peroxide, and an inorganic filler in a content proportion ranging from 50% by mass to 95% by mass, inclusive. A silane coupling agent is bonded to the inorganic filler, a total organic carbon content of the inorganic filler in proportion being ranging from 0.1% by mass to 1.0% by mass, inclusive, in a state before the inorganic filler is mixed with at least one of the thermosetting acrylic resin and the organic peroxide. The silane coupling agent has an acrylic group.

Find Patent Forward Citations

Loading…