The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2023
Filed:
Feb. 21, 2019
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 51/08 (2006.01); C08F 290/06 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C08L 51/08 (2013.01); C08F 290/06 (2013.01); H01L 21/4853 (2013.01); H01L 21/563 (2013.01); H01L 23/295 (2013.01); H01L 23/3185 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); C08L 2203/206 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81207 (2013.01); H01L 2924/067 (2013.01); H01L 2924/18161 (2013.01);
Abstract
An encapsulation resin composition is used to hermetically seal a gap between a base member and a semiconductor chip bonded onto the base member. The encapsulation resin composition has a reaction start temperature of 160° C. or less. A melt viscosity of the encapsulation resin composition is 200 Pa·s or less at the reaction start temperature, 400 Pa·s or less at any temperature which is equal to or higher than a temperature lower by 40° C. than the reaction start temperature and which is equal to or lower than the reaction start temperature, and 1,000 Pa·s or less at a temperature lower by 50° C. than the reaction start temperature.