Panasonic Intellectual Property Management Co., Ltd.

Naoki Kanagawa

Shigeru Yamatsu

Kazuki Watanabe

Daisuke Sasaki

Jin Jin

An encapsulation resin composition is used to hermetically seal a gap between a base member and a semiconductor chip bonded onto the base member. The encapsulation resin composition has a reaction start temperature of 160&#xb0; C. or less. A melt viscosity of the encapsulation resin composition is 200 Pa&#xb7;s or less at the reaction start temperature, 400 Pa&#xb7;s or less at any temperature which is equal to or higher than a temperature lower by 40&#xb0; C. than the reaction start temperature and which is equal to or lower than the reaction start temperature, and 1,000 Pa&#xb7;s or less at a temperature lower by 50&#xb0; C. than the reaction start temperature.

Encapsulation resin composition, laminated sheet, cured product, semiconductor device, and method for fabricating semiconductor device

A thermosetting composition for use as an underfill material contains: a mono- or bifunctional acrylic compound; a thermo-radical polymerization initiator; silica; and an elastomer including a 1,2-vinyl group. The thermosetting composition is liquid and has a property of turning, when cured thermally, into a cured product having a relative dielectric constant of 3.2 or less at 25&#xb0; C. and a dielectric loss tangent of 0.013 or less at 25&#xb0; C.

Thermosetting composition for use as underfill material, and semiconductor device

The acrylic composition for sealing contains an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, and a thermal radical polymerization initiator.

Acrylic composition for encapsulation, sheet material, laminated sheet, cured object, semiconductor device, and process for producing semiconductor device

A sealing acrylic resin composition contains a thermosetting acrylic resin in liquid phase, an organic peroxide, and an inorganic filler in a content proportion ranging from 50% by mass to 95% by mass, inclusive. A silane coupling agent is bonded to the inorganic filler, a total organic carbon content of the inorganic filler in proportion being ranging from 0.1% by mass to 1.0% by mass, inclusive, in a state before the inorganic filler is mixed with at least one of the thermosetting acrylic resin and the organic peroxide. The silane coupling agent has an acrylic group.

Acrylic resin composition for sealing, cured product of same, method for producing same, semiconductor device using said resin composition, and method for manufacturing said semiconductor device

The acrylic composition for sealing contains an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, a thermal radical polymerization initiator, and a thermoplastic resin.

Acrylic composition for sealing, sheet material, multilayer sheet, cured product, semiconductor device and method for manufacturing semiconductor device

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Mie, Japan

Naoki Kanagawa