Kyoto, Japan

Naofumi Enkyo

This inventor holds 2 USPTO granted patents. Top assignee: Murata Manufacturing Co., Ltd.. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Naofumi Enkyo. Retrieved from https://idiyas.com/inventor/naofumi-enkyo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2017

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2 patents (USPTO):Explore Patents

Title: Naofumi Enkyo: Innovator in Composite Module Technology

Introduction

Naofumi Enkyo is a prominent inventor based in Kyoto, Japan. He has made significant contributions to the field of composite module technology, holding a total of 2 patents. His work focuses on improving the precision and functionality of electronic components.

Latest Patents

Enkyo's latest patents include innovative designs for composite modules. One of his patents describes a composite module that consists of multiple substrates housed together. This design prevents deformation of the substrates and enhances the mounting precision within the housing. Another patent details a wireless LAN module that features a first substrate and a second substrate arranged to optimize their interaction. This module includes an external connector for electronic apparatuses and a heat dissipation member to ensure efficient operation.

Career Highlights

Naofumi Enkyo is associated with Murata Manufacturing Co., Ltd., a leading company in the electronics industry. His work at Murata has allowed him to develop cutting-edge technologies that are essential for modern electronic devices. His innovative approach has positioned him as a key figure in the advancement of composite module technology.

Collaborations

Enkyo has collaborated with notable coworkers such as Koji Kawano and Koki Kato. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Naofumi Enkyo's contributions to composite module technology exemplify his dedication to innovation in the electronics field. His patents reflect a commitment to enhancing the performance and reliability of electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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