The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Nov. 14, 2014
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventors:
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 5/02 (2006.01); H05K 7/02 (2006.01); H04B 1/3888 (2015.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); H05K 5/0278 (2013.01); H05K 7/026 (2013.01); H05K 7/20445 (2013.01); H05K 7/20472 (2013.01); H04B 1/3888 (2013.01);
Abstract
A wireless LAN module as a composite module according to the present invention includes a first substrateand a second substratethat is so disposed as opposed to the other principal surfaceof the first substrate. An external connectorfor the connection with an electronic apparatus is mounted on one principal surfaceof the first substrate. An electronic component deviceis mounted on one principal surface of the second substratein a region opposing the external connectorsandwiching the first substratetherebetween. A heat dissipation memberis disposed on a surface which is an opposite side to the mounting-surface of the electronic component device