Murata Manufacturing Co., Ltd.

Naofumi Enkyo

Koji Kawano

Koki Kato

A composite module includes a plurality of substrates in a housing, prevents deformation of the stated substrates, and has a characteristic with an improved mounting precision of the substrates within the housing. A wireless LAN module as a composite module according to the present invention includes a first substrate (), a second substrate () that is so disposed as opposed to the other principal surface () of the first substrate (), and a housing () that has accommodation sections () and () for accommodating the first substrate () and the second substrate (). Further, substrate-support projections for supporting one principal surface and the other principal surface of each of the first substrate () and the second substrate (), are formed on inner wall surfaces () and () of the accommodation sections () and () in the housing ().

Composite module

A wireless LAN module as a composite module according to the present invention includes a first substrateand a second substratethat is so disposed as opposed to the other principal surfaceof the first substrate. An external connectorfor the connection with an electronic apparatus is mounted on one principal surfaceof the first substrate. An electronic component deviceis mounted on one principal surface of the second substratein a region opposing the external connectorsandwiching the first substratetherebetween. A heat dissipation memberis disposed on a surface which is an opposite side to the mounting-surface of the electronic component device

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Kyoto, Japan

Naofumi Enkyo