The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Nov. 14, 2014
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Koji Kawano, Kyoto, JP;

Naofumi Enkyo, Kyoto, JP;

Koki Kato, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 7/14 (2006.01); H05K 5/02 (2006.01); H04B 1/3888 (2015.01);
U.S. Cl.
CPC ...
H05K 7/1427 (2013.01); H04B 1/3888 (2013.01); H05K 5/0217 (2013.01); H05K 7/142 (2013.01); H05K 7/1417 (2013.01);
Abstract

A composite module includes a plurality of substrates in a housing, prevents deformation of the stated substrates, and has a characteristic with an improved mounting precision of the substrates within the housing. A wireless LAN module as a composite module according to the present invention includes a first substrate (), a second substrate () that is so disposed as opposed to the other principal surface () of the first substrate (), and a housing () that has accommodation sections () and () for accommodating the first substrate () and the second substrate (). Further, substrate-support projections for supporting one principal surface and the other principal surface of each of the first substrate () and the second substrate (), are formed on inner wall surfaces () and () of the accommodation sections () and () in the housing ().


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