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For the Inventor, By the Inventor

Cheonan, South Korea

Myung-Kee Chung

This inventor holds 7 USPTO granted patents. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2002-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Myung-Kee Chung. Retrieved from https://idiyas.com/inventor/myung-kee-chung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7

% Patents Active = 100.0

Average Co-Inventor Count = 3.5

ph-index = 4

Forward Citations = 441(Granted Patents)


Location History:

  • Chungcheongnam-do, KR (2002 - 2006)
  • Cheonan-si, KR (2009 - 2020)

Company Filing History:

goldMedal7 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2002-2020

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7 patents (USPTO):Explore Patents
1. 10872802 - Method of debonding a carrier substrate from a device substrate, apparatus for performing the same, and method of singulating semiconductor chips including the same (2020-12-22),
2. 9041181 - Land grid array package capable of decreasing a height difference between a land and a solder resist (2015-05-26),
3. 8088648 - Method of manufacturing a chip stack package (2012-01-03),
4. 7807507 - Backgrinding-underfill film, method of forming the same, semiconductor package using the backgrinding-underfill film, and method of forming the semiconductor package (2010-10-05),
5. 7588964 - Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same (2009-09-15),
6. 7064435 - Semiconductor package with improved ball land structure (2006-06-20),
7. 6448661 - Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof (2002-09-10),

Title: Myung-Kee Chung: Innovator in Semiconductor Technology

Introduction

Myung-Kee Chung is a prominent inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on innovative methods and apparatuses that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

Among his latest patents is a method of debonding a carrier substrate from a device substrate. This method involves irradiating ultraviolet (UV) light to an adhesive tape through the carrier substrate, which is attached to the device substrate. This process weakens the adhesive force of the tape, allowing for easier separation. Another notable patent is for a land grid array (LGA) package designed to decrease the height difference between a land and a solder resist. This package includes a substrate with multiple lands and a semiconductor chip, showcasing Chung's innovative approach to semiconductor packaging.

Career Highlights

Myung-Kee Chung is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the field.

Collaborations

Chung has collaborated with notable colleagues, including Hyeong-Seob Kim and Sa-Yoon Kang. Their combined expertise has fostered a productive environment for innovation and development in semiconductor technologies.

Conclusion

Myung-Kee Chung's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the industry. His advancements continue to shape the future of semiconductor applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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