Myung-Kee Chung is a prominent inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on innovative methods and apparatuses that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

Among his latest patents is a method of debonding a carrier substrate from a device substrate. This method involves irradiating ultraviolet (UV) light to an adhesive tape through the carrier substrate, which is attached to the device substrate. This process weakens the adhesive force of the tape, allowing for easier separation. Another notable patent is for a land grid array (LGA) package designed to decrease the height difference between a land and a solder resist. This package includes a substrate with multiple lands and a semiconductor chip, showcasing Chung's innovative approach to semiconductor packaging.

Career Highlights

Myung-Kee Chung is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the field.

Collaborations

Chung has collaborated with notable colleagues, including Hyeong-Seob Kim and Sa-Yoon Kang. Their combined expertise has fostered a productive environment for innovation and development in semiconductor technologies.

Conclusion

Myung-Kee Chung's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the industry. His advancements continue to shape the future of semiconductor applications.

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