This inventor holds 4 USPTO granted patents. Top assignee: Hitachi, Ltd.. Active years: 1993-2003.
Company Filing History:
Years Active: 1993-2003
Title: Mutsumi Horikoshi: Innovator in Glass-Ceramic Wiring Technology
Introduction
Mutsumi Horikoshi is a notable inventor based in Machida, Japan. He has made significant contributions to the field of glass-ceramic wiring technology, holding a total of 4 patents. His innovative approaches have paved the way for advancements in manufacturing processes.
Latest Patents
Horikoshi's latest patents include a method of manufacturing via interconnection of glass-ceramic wiring boards. This method involves blending copper powder with a vehicle that includes a cellulose derivative. Additionally, a metal oxide powder with a mean particle diameter ranging from at least 1 µm to at most 4 µm is added to the vehicle. The viscosity of the vehicle is adjusted by incorporating the cellulose derivative, which is then filled into a via. The process concludes with sintering the via at temperatures between 900°C and 1060°C, resulting in a robust via interconnection. Another significant patent is for a glass-ceramic wiring board that features an insulating substrate, a via, and a via interconnection filled with sintered material containing metal particles. The metal particles are characterized by a cross-sectional area of less than 2000 µm, determined through cross-sectional examination.
Career Highlights
Mutsumi Horikoshi is currently employed at Hitachi, Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the efficiency and effectiveness of wiring boards used in various applications.
Collaborations
Horikoshi has collaborated with several esteemed colleagues, including Masahide Okamoto and Shosaku Ishihara. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and expertise.
Conclusion
Mutsumi Horikoshi's contributions to the field of glass-ceramic wiring technology exemplify his innovative spirit and dedication to advancing manufacturing processes. His patents reflect a commitment to excellence and a vision for the future of technology.