The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2002
Filed:
Apr. 17, 2001
Applicant:
Inventors:
Norihiro Ami, Yokohama, JP;
Masahide Okamoto, Yokohama, JP;
Shosaku Ishihara, Chigasaki, JP;
Minoru Tanaka, Yokohama, JP;
Mutsumi Horikoshi, Machida, JP;
Akihiro Yasuda, Hadano, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 1/204 ;
U.S. Cl.
CPC ...
H01R 1/204 ;
Abstract
A glass-ceramic wiring board includes an insulating substrate, a via disposed in the insulating substrate and a via interconnection filling the interior of the via. The via interconnection is sintered material having metal particles. The metal particles have a cross-sectional area per one metal particle surrounded by a metal particle boundary of less than 2000 &mgr; , which can be determined by cutting, etching and examining a cross-section of the via.