Company Filing History:
Years Active: 2001-2003
Title: Norihiro Ami: Innovator in Glass-Ceramic Wiring Technology
Introduction
Norihiro Ami is a prominent inventor based in Yokohama, Japan. He has made significant contributions to the field of materials science, particularly in the development of glass-ceramic wiring technologies. With a total of 3 patents to his name, Ami continues to push the boundaries of innovation in his industry.
Latest Patents
Ami's latest patents include a method of manufacturing via interconnection of glass-ceramic wiring boards. This method involves blending copper powder with a vehicle that includes a cellulose derivative, adding a metal oxide powder with a specific particle diameter, and adjusting the viscosity of the vehicle. The process culminates in sintering the via at high temperatures to form a robust interconnection. Another notable patent is for a glass-ceramic wiring board itself, which features an insulating substrate and a via filled with a sintered material containing metal particles. The design ensures that the metal particles have a cross-sectional area per particle that is less than 2000 micrometers, enhancing the board's performance.
Career Highlights
Norihiro Ami is currently employed at Hitachi, Ltd., where he applies his expertise in materials science to develop innovative solutions. His work has been instrumental in advancing the capabilities of glass-ceramic wiring technologies, which are crucial for modern electronic devices.
Collaborations
Ami collaborates with several talented individuals in his field, including Masahide Okamoto and Shosaku Ishihara. These collaborations foster a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Norihiro Ami's contributions to the field of glass-ceramic wiring technology exemplify the spirit of innovation. His patents and ongoing work at Hitachi, Ltd. highlight his commitment to advancing materials science. Through his collaborations and research, Ami continues to shape the future of electronic components.