The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2003
Filed:
Apr. 17, 2001
Applicant:
Inventors:
Norihiro Ami, Yokohama, JP;
Masahide Okamoto, Yokohama, JP;
Shosaku Ishihara, Chigasaki, JP;
Minoru Tanaka, Yokohama, JP;
Mutsumi Horikoshi, Machida, JP;
Akihiro Yasuda, Hadano, JP;
Assignee:
Hitachi, ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01K 3/10 ;
U.S. Cl.
CPC ...
H01K 3/10 ;
Abstract
A via interconnection of a glass-ceramic wiring board is made by blending a copper powder to a vehicle including a cellulose derivative, adding a metal oxide powder having a mean particle diameter of from at least 1 &mgr;m to at most 4 &mgr;m to the vehicle and blending them, adjusting the viscosity of the vehicle by adding the cellulose derivative and filling them to a via; and sintering the via at a temperature of at least 900° C. to at most 1060° C., and forming the via interconnection.