The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2001

Filed:

Feb. 10, 2000
Applicant:
Inventors:

Norihiro Ami, Yokohama, JP;

Masahide Okamoto, Yokohama, JP;

Shosaku Ishihara, Chigasaki, JP;

Minoru Tanaka, Yokohama, JP;

Mutsumi Horikoshi, Machida, JP;

Akihiro Yasuda, Hadano, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 1/204 ; H01R 1/232 ; H05K 1/11 ;
U.S. Cl.
CPC ...
H01R 1/204 ; H01R 1/232 ; H05K 1/11 ;
Abstract

In a ceramic wiring board which comprises a copper via, breaks and defects of via interconnections resulting from enlargement of copper particles in the interior of the via during sintering, are prevented. For this purpose, alumina of mean particle diameter from 1 &mgr;m to 4 &mgr;m is disposed in the interior of the via interconnection after sintering at an average interval of 7.4 &mgr;m or less.


Find Patent Forward Citations

Ami, Norihiro. (2001). Ceramics substrate with electronic circuit and its manufacturing method (U.S. Patent No. 6248960). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6248960

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…