The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2001
Filed:
Feb. 10, 2000
Applicant:
Inventors:
Norihiro Ami, Yokohama, JP;
Masahide Okamoto, Yokohama, JP;
Shosaku Ishihara, Chigasaki, JP;
Minoru Tanaka, Yokohama, JP;
Mutsumi Horikoshi, Machida, JP;
Akihiro Yasuda, Hadano, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 1/204 ; H01R 1/232 ; H05K 1/11 ;
U.S. Cl.
CPC ...
H01R 1/204 ; H01R 1/232 ; H05K 1/11 ;
Abstract
In a ceramic wiring board which comprises a copper via, breaks and defects of via interconnections resulting from enlargement of copper particles in the interior of the via during sintering, are prevented. For this purpose, alumina of mean particle diameter from 1 &mgr;m to 4 &mgr;m is disposed in the interior of the via interconnection after sintering at an average interval of 7.4 &mgr;m or less.