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For the Inventor, By the Inventor

Atlanta, GA, United States of America

Muhannad S Bakir

This inventor holds 18 USPTO granted patents and 5 published patent applications. Top assignees: Georgia Tech Research Corporation, University of California, Wayne State University. Active years: 2004-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Muhannad S Bakir. Retrieved from https://idiyas.com/inventor/muhannad-s-bakir

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 16.7

Average Co-Inventor Count = 3.3

ph-index = 9

Forward Citations = 215(Granted Patents)


Company Filing History:

goldMedal18 out of 2,196 
 
Georgia Tech Research Corporation
 patents
silverMedal1 out of 16,035 
 
University of California
 patents
bronzeMedal1 out of 603 
 
Wayne State University
 patents
where one patent can have more than one assignee

Years Active: 2004-2024

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18 patents (USPTO):Explore Patents
1. 12027488 - Methods of forming stacked integrated circuits using selective thermal atomic layer deposition on conductive contacts and structures formed using the same (2024-07-02),
2. 10636731 - Mechanically flexible interconnects, methods of making the same, and methods of use (2020-04-28),
3. 10330874 - Mixed-signal substrate with integrated through-substrate vias (2019-06-25),
4. 8803509 - Modular nano and microscale sensors (2014-08-12),
5. 8563365 - Air-gap C4 fluidic I/O interconnects and methods of fabricating same (2013-10-22),
6. 8546930 - 3-D ICs equipped with double sided power, coolant, and data features (2013-10-01),
7. 7928563 - 3-D ICs with microfluidic interconnects and methods of constructing same (2011-04-19),
8. 7798817 - Integrated circuit interconnects with coaxial conductors (2010-09-21),
9. 7554347 - High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use (2009-06-30),
10. 7468558 - Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof (2008-12-23),
11. 7266267 - Microfluidic, optical, and electrical input output interconnects, methods of fabrication thereof, and methods of use thereof (2007-09-04),
12. 7135777 - Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof (2006-11-14),
13. 7132736 - Devices having compliant wafer-level packages with pillars and methods of fabrication (2006-11-07),
14. 7099525 - Dual-mode/function optical and electrical interconnects, methods of fabrication thereof, and methods of use thereof (2006-08-29),
15. 6954576 - Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package (2005-10-11),

Title: Innovator Spotlight: Muhannad S Bakir Revolutionizing Integrated Circuits

Introduction:

Muhannad S Bakir, a brilliant innovator hailing from Atlanta, GA, has made significant strides in the field of integrated circuits. With an impressive portfolio of 18 patents, his groundbreaking work has paved the way for advancements in semiconductor technology.

Latest Patents:

Among his latest patents is the innovative method of forming stacked integrated circuits using selective thermal atomic layer deposition on conductive contacts. This process involves depositing a layer of selective metal through a thermal Atomic Layer Deposition (ALD) process to create a bond between electrical contacts, ultimately enhancing the performance of integrated circuits. Additionally, his work on mechanically flexible interconnects has opened doors for the development of flexible electronic devices.

Career Highlights:

Muhannad S Bakir's expertise has been instrumental in driving innovation at esteemed institutions such as the Georgia Tech Research Corporation and the University of California. His contributions have not only expanded the frontiers of technology but have also inspired the next generation of inventors.

Collaborations:

Throughout his career, Muhannad S Bakir has collaborated closely with industry pioneers such as James D Meindl and Paul Albert Kohl. Together, they have synergized their talents to bring forth cutting-edge solutions in the realm of semiconductor engineering.

Conclusion:

In conclusion, Muhannad S Bakir's relentless pursuit of innovation and his unwavering dedication to advancing integrated circuits have positioned him as a trailblazer in the field. His exceptional contributions underscore the transformative impact of inventors in shaping the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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