The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2024

Filed:

Sep. 09, 2021
Applicants:

The Regents of the University of California, Oakland, CA (US);

Georgia Tech Research Corporation, Atlanta, GA (US);

Wayne State University, Detroit, MI (US);

Inventors:

Mike Breeden, La Jolla, CA (US);

Victor Wang, La Jolla, CA (US);

Andrew Kummel, La Jolla, CA (US);

Ming-Jui Li, Atlanta, GA (US);

Muhannad Bakir, Atlanta, GA (US);

Jonathan Hollin, Albany, NY (US);

Nyi Myat Khine Linn, Detroit, MI (US);

Charles H. Winter, Bloomfield Hills, MI (US);

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/82 (2013.01); H01L 24/24 (2013.01); H01L 2224/24145 (2013.01); H01L 2224/24225 (2013.01); H01L 2224/245 (2013.01); H01L 2224/2511 (2013.01); H01L 2224/82108 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01044 (2013.01); H01L 2924/01074 (2013.01);
Abstract

Methods of bonding and structures with such bonding are disclosed. One such method includes providing a first substrate with a first electrical contact; providing a second substrate with a second electrical contact above the first electrical contact, wherein an upper surface of the first electrical contact is spaced apart from a lower surface of the second electrical contact by a gap; and depositing a layer of selective metal on the lower surface of the second electrical contact and on the upper surface of the first electrical contact by a thermal Atomic Layer Deposition (ALD) process until the gap is filled to create a bond between the first electrical contact and the second electrical contact.


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