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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10330874 B1

PDFFull Text
Date of Patent:
Jun. 25, 2019

Filed:

Feb. 02, 2017

Mixed-signal substrate with integrated through-substrate vias

Applicant:

Georgia Tech Research Corporation, Atlanta, GA (US);

Inventors:

Paragkumar Thadesar, Atlanta, GA (US);

Muhannad S. Bakir, Atlanta, GA (US);

Assignee:

Georgia Tech Research Corporation, Atlanta, GA (US);

Attorneys:

Troutman Sanders LLP

Ryan A. Schneider

Primary Examiner:

Steven T Sawyer

Int. Cl.
CPC ...
H05K 1/11 (2006.01); G02B 6/43 (2006.01); H01L 21/768 (2006.01); H01L 23/14 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
G02B 6/43 (2013.01); H01L 21/76898 (2013.01); H01L 23/147 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01);
Abstract

Disclosed are a variety of mixed-signal substrates comprising a plurality of photo-defined through substrate vias and methods of making the same. In an embodiment, a mixed-signal substrate can comprise a plurality of trenches embedded in a substrate, a photodefineable polymer within at least a portion of each trench, the photodefineable polymer defining one or more channels within each of the plurality of trenches, and a conductive material filling at least a portion of the one or more channels within the photodefineable polymer to form one or more through substrate vias. The photo-defined through substrate vias can comprise a variety of arrangements, numbers of vias, shapes, and dimensions across a single substrate.

Find Patent Forward Citations

Thadesar, Paragkumar. (2019). Mixed-signal substrate with integrated through-substrate vias (U.S. Patent No. 10330874). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10330874

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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