This inventor holds 1 USPTO granted patent. Top assignees: Ebara Corporation, Kabushiki Kaisha Toshiba. Active years: 1998.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
1 out of 2,579 
1 out of 53,276 
Years Active: 1998
Title: Motoaki Okada and Semiconductor Wafer Cleaning
Introduction
Motoaki Okada is an inventor associated with Tokyo, Japan, and has 1 patent. His patented work concerns a method for cleaning semiconductor wafers.
Latest Patents
Okada’s patent, “Method for Cleaning Workpiece,” describes scrubbing a semiconductor wafer with a cleaning member made primarily of polyurethane. The member has micropores on the surface that contacts the wafer, with an average diameter ranging from 10 to 200 micrometers. It may be made from polyurethane foam or from non-woven fibers bound with urethane resin.
The method is designed to remove particles strongly attached to the wafer. Scrubbing can also remove surface irregularities and crystalline protrusions, helping adjust surface roughness and produce a flatter wafer surface.
Career Highlights
Okada’s listed company affiliations include Ebara Corporation and Toshiba Corporation.
Collaborations
His listed coworkers include Riichiro Aoki and Atsushi Shigeta.
Conclusion
Motoaki Okada’s patent focuses on polyurethane-based scrubbing as a way to clean semiconductor wafers, remove stubborn particles, and refine surface flatness.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile