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For the Inventor, By the Inventor

Dresden, Germany

Momtchil Stavrev

This inventor holds 5 USPTO granted patents and 3 published patent applications. Top assignee: Infineon Technologies Ag. Active years: 2006-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Momtchil Stavrev. Retrieved from https://idiyas.com/inventor/momtchil-stavrev

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 40.0

Average Co-Inventor Count = 4.1

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:

goldMedal5 out of 15,023 
 
Infineon Technologies Ag
 patents

Years Active: 2006-2025

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5 patents (USPTO):Explore Patents
1. 12453291 - Semiconductor die with sensor section located at the edge (2025-10-21),
2. 10249583 - Semiconductor die bond pad with insulating separator (2019-04-02),
3. 7141507 - Method for production of a semiconductor structure (2006-11-28),
4. 7037777 - Process for producing an etching mask on a microstructure, in particular a semiconductor structure with trench capacitors, and corresponding use of the etching mask (2006-05-02),
5. 7018781 - Method for fabricating a contact hole plane in a memory module (2006-03-28),

Title: The Innovative Contributions of Momtchil Stavrev

Introduction

Momtchil Stavrev is a notable inventor based in Dresden, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on enhancing the functionality and efficiency of semiconductor devices.

Latest Patents

Stavrev's latest patents include innovative designs that address critical aspects of semiconductor functionality. One of his notable inventions is a semiconductor die with a sensor section located at the edge. This design integrates a microelectronic section with a sensor section, allowing for improved performance in various applications. Another significant patent is for a semiconductor die bond pad with an insulating separator. This invention features a bond pad above a last metallization layer, designed to enhance the reliability and efficiency of semiconductor connections.

Career Highlights

Momtchil Stavrev is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the industry.

Collaborations

Throughout his career, Stavrev has collaborated with talented individuals such as Oliver Genz and Alexander Reb. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.

Conclusion

Momtchil Stavrev's contributions to semiconductor technology exemplify the spirit of innovation. His patents and work at Infineon Technologies AG highlight his commitment to advancing the field. His achievements continue to inspire future developments in semiconductor design and functionality.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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