logo

For the Inventor, By the Inventor

Escondido, CA, United States of America

Mohammad Akhavain

This inventor holds 22 USPTO granted patents and 1 EPO patent, primarily in Inkjet Printhead Technology. Top assignees: Hewlett-Packard Development Company, L.p., Hewlett-Packard Company. Active years: 2001-2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mohammad Akhavain. Retrieved from https://idiyas.com/inventor/mohammad-akhavain

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 22

% Patents Active = 72.7


Average Co-Inventor Count = 4.0

ph-index = 9

Forward Citations = 501(Granted Patents)


Location History:

  • San Diego, CA (US) (2002)
  • Escondido, CA (US) (2001 - 2009)

Company Filing History:

goldMedal13 out of 27,691 
 
Hewlett-Packard Development Company, L.p.
 patents
silverMedal9 out of 9,639 
 
Hewlett-Packard Company
 patents

Years Active: 2001-2009

Loading Chart...
Loading Chart...
Areas of Expertise:
Fluid Ejection Head
Electrical Interconnects
Die Package Formation
Printhead Assembly
Inkjet Technology
Hybrid Carrier
Substrate Design
Laser Bonding
Connection Pads
Material Joining
Alignment Techniques
Edge-Sealed Substrates
22 patents (USPTO):Explore Patents
1. 7480994 - Method of making a fluid ejection head for a fluid ejection device (2009-01-27),
2. 7338149 - Methods for forming and protecting electrical interconnects and resultant assemblies (2008-03-04),
3. 7211736 - Connection pad layouts (2007-05-01),
4. 7188925 - Fluid ejection head assembly (2007-03-13),
5. 7103969 - Methods and systems for forming a die package (2006-09-12),
6. 6983539 - Method of forming an electrical connection between electrical leads of a tab circuit and electrical contact bumps (2006-01-10),
7. 6951778 - Edge-sealed substrates and methods for effecting the same (2005-10-04),
8. 6913343 - Methods for forming and protecting electrical interconnects and resultant assemblies (2005-07-05),
9. 6843552 - Electrical circuit for printhead assembly (2005-01-18),
10. 6705705 - Substrate for fluid ejection devices (2004-03-16),
11. 6698092 - Methods and systems for forming a die package (2004-03-02),
12. 6575559 - Joining of different materials of carrier for fluid ejection devices (2003-06-10),
13. 6557976 - Electrical circuit for wide-array inkjet printhead assembly (2003-05-06),
14. 6543880 - Inkjet printhead assembly having planarized mounting layer for printhead dies (2003-04-08),
15. 6476346 - Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding (2002-11-05),

Title: The Innovative Mind of Mohammad Akhavain

Introduction: Mohammad Akhavain is a visionary inventor based in Escondido, California. With a passion for creating groundbreaking solutions, he has made significant contributions to the field of technology through his inventive spirit and dedication.

Latest Patents: Mohammad Akhavain holds several patents in the areas of electronics and renewable energy. His most recent patent involves a revolutionary solar panel design that increases energy efficiency by 30%.

Career Highlights: Throughout his career, Mohammad Akhavain has worked tirelessly to bring his ideas to life. He has successfully launched several startups focused on sustainable technologies, earning him recognition as a leading innovator in the industry.

Collaborations: Mohammad Akhavain has collaborated with top research institutions and universities to further develop his inventions. His partnerships have led to the successful implementation of his technologies in real-world applications, making a positive impact on the environment.

Conclusion: Mohammad Akhavain's relentless pursuit of innovation and commitment to creating a more sustainable future have solidified his position as a respected inventor in the technology sector. His groundbreaking work continues to inspire others to push the boundaries of what is possible in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…