The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2005
Filed:
Apr. 30, 2003
Mohammad Akhavain, Escondido, CA (US);
Joseph E. Scheffelin, Poway, CA (US);
Noah Lassar, San Diego, CA (US);
Conrad Lepe, Escondido, CA (US);
Mohammad Akhavain, Escondido, CA (US);
Joseph E. Scheffelin, Poway, CA (US);
Noah Lassar, San Diego, CA (US);
Conrad Lepe, Escondido, CA (US);
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Abstract
The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.