The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2005
Filed:
Oct. 31, 2002
Mohammad Akhavain, Escondido, CA (US);
Stanley G. Markwell, Escondido, CA (US);
Janis Horvath, San Diego, CA (US);
Joseph E. Scheffelin, Poway, CA (US);
Mohammad Akhavain, Escondido, CA (US);
Stanley G. Markwell, Escondido, CA (US);
Janis Horvath, San Diego, CA (US);
Joseph E. Scheffelin, Poway, CA (US);
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Abstract
Methods and systems of protecting substrates that are intended for use in fluidic devices are described. In accordance with one embodiment, sealant material is applied over one or more edges of at least one multi-chip module substrate that is intended for use in a fluidic device. At least one edge has an exposed electrical interconnect and the sealant material is applied over less than an entirety of the substrate and sufficiently to cover the exposed electrical interconnect. The sealant material is exposed to conditions effective to seal the one or more edges.