The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2003

Filed:

Aug. 25, 2000
Applicant:
Inventors:

Mohammad Akhavain, Escondido, CA (US);

Robert-Scott Melendrino Lopez, Escondido, CA (US);

Brian J. Keefe, La Jolla, CA (US);

Janis Horvath, San Diego, CA (US);

Joseph E. Scheffelin, Poway, CA (US);

David K. Mc Elfresh, San Diego, CA (US);

Assignee:

Hewlett-Packard Company, Fort Collins, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/155 ;
U.S. Cl.
CPC ...
B41J 2/155 ;
Abstract

A method of forming an inkjet printhead assembly includes providing a substrate, disposing a planarization layer on a face of the substrate such that a first surface of the planarization layer contacts the face of the substrate, mechanically planarizing a second surface of the planarization layer opposite the first surface, including reducing a thickness of at least a portion of the first planarization layer, and mounting a plurality of printhead dies on the second surface of the planarization layer.


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Akhavain, Mohammad. (2003). Inkjet printhead assembly having planarized mounting layer for printhead dies (U.S. Patent No. 6543880). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6543880

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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