Location History:
- Yamagata, JP (2001 - 2005)
- Sakata, JP (2006)
Company Filing History:
5 out of 11 
1 out of 80 
1 out of 1 Years Active: 2001-2006
Title: Innovations of Mitsuo Osada
Introduction
Mitsuo Osada is a prominent inventor based in Yamagata, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the development of heat dissipation substrates. With a total of seven patents to his name, Osada's work has advanced the efficiency and effectiveness of semiconductor packaging.
Latest Patents
One of his latest patents is a method of producing a heat dissipation substrate of molybdenum powder impregnated with copper. This innovative material is designed for semiconductor mounting and features a copper-molybdenum rolled composite. The process involves impregnating melted copper into the voids of a molybdenum powder compact, resulting in a composite that exhibits superior thermal conductivity. The final rolling direction of the plate material achieves a coefficient of linear expansion of 8.3×10/K at temperatures ranging from 30 to 800 degrees Celsius. This substrate material is not only superior in thermal conductivity compared to CMC clad materials but is also easy to machine using a punch press.
Another notable patent involves a semiconductor package and the method for producing a heat-radiating substrate. This package is designed to mount semiconductor chips and features a heat-radiating substrate with a thickness of less than 0.4 mm, made from a Cu-Mo composite. The production process includes isostatic molding and the careful impregnation of copper into the molybdenum green compact, resulting in a highly efficient heat-radiating substrate.
Career Highlights
Throughout his career, Mitsuo Osada has worked with notable companies such as Tokyo Tungsten Co., Ltd. and ALMT Corporation. His experience in these organizations has contributed to his expertise in materials science and semiconductor technology.
Collaborations
Osada has collaborated with several professionals in his field, including Norio Hirayama and Hidetoshi Maesato. These collaborations have further enriched his work and innovations in semiconductor packaging.
Conclusion
Mitsuo Osada's contributions to the field of semiconductor technology through his innovative patents and collaborations have significantly impacted the industry. His work continues to pave the way for advancements in heat dissipation materials and semiconductor packaging.