The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2006
Filed:
Apr. 12, 2001
Mitsuo Osada, Sakata, JP;
Norio Hirayama, Sakata, JP;
Tadashi Arikawa, Toyama, JP;
Yoshinari Amano, Sakata, JP;
Hidetoshi Maesato, Sakata, JP;
Hidefumi Hayashi, Sakata, JP;
Hiroshi Murai, Sakata, JP;
Mitsuo Osada, Sakata, JP;
Norio Hirayama, Sakata, JP;
Tadashi Arikawa, Toyama, JP;
Yoshinari Amano, Sakata, JP;
Hidetoshi Maesato, Sakata, JP;
Hidefumi Hayashi, Sakata, JP;
Hiroshi Murai, Sakata, JP;
A.L.M.T. Corp., Tokyo, JP;
Abstract
A material for a semiconductor-mounting heat dissipation substrate comprises a copper-molybdenum rolled composite obtained by impregnating melted copper into a void between powder particles of a molybdenum powder compact to obtain a composite of molybdenum and copper and then rolling the composite. In a final rolling direction of a plate material, the coefficient of linear expansion is 8.3×10/K at 30–800° C. The material for a semiconductor-mounting heat dissipation substrate is superior in thermal conductivity to a CMC clad material and easy in machining by a punch press. The substrate material is used as a heat dissipation substrate () of a ceramic package ().