Hidetoshi Maesato

Title: Hidetoshi Maesato: Innovator in Semiconductor Technology

Introduction

Hidetoshi Maesato is a prominent inventor based in Sakata, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the development of heat dissipation substrates. With a total of 5 patents to his name, Maesato's work has advanced the efficiency and effectiveness of semiconductor packaging.

Latest Patents

One of Maesato's latest patents is a method of producing a heat dissipation substrate of molybdenum powder impregnated with copper. This innovative material is designed for semiconductor mounting and features a copper-molybdenum rolled composite. The process involves impregnating melted copper into a void between powder particles of a molybdenum powder compact, resulting in a composite that exhibits superior thermal conductivity compared to traditional materials. Another notable patent involves a semiconductor package that utilizes a heat-radiating substrate with a thickness of less than 0.4 mm, made from a Cu-Mo composite. This substrate is produced through a meticulous process of isostatic molding and rolling, ensuring high performance in heat dissipation.

Career Highlights

Throughout his career, Hidetoshi Maesato has worked with notable companies such as Tokyo Tungsten Co., Ltd. and A.L.M.T. Corporation. His experience in these organizations has allowed him to refine his expertise in materials science and semiconductor technology.

Collaborations

Maesato has collaborated with esteemed colleagues, including Mitsuo Osada and Norio Hirayama. These partnerships have fostered innovation and contributed to the advancement of semiconductor technologies.

Conclusion

Hidetoshi Maesato's contributions to semiconductor technology through his innovative patents and collaborations highlight his role as a key figure in the field. His work continues to influence the development of efficient heat dissipation materials for semiconductor applications.