The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
Jun. 07, 2001
Applicant:
Inventors:
Mitsuo Osada, Yamagata, JP;
Akira Ichida, Toyama, JP;
Norio Hirayama, Yamagata, JP;
Kiyoshi Asai, Yamagata, JP;
Hidetoshi Maesato, Yamagata, JP;
Tadashi Arikawa, Toyama, JP;
Assignee:
Tokyo Tungsten Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/24 ; B22F 3/26 ;
U.S. Cl.
CPC ...
B22F 3/24 ; B22F 3/26 ;
Abstract
A heat sink substrate comprises a Cu—Mo composite substrate composed of a molybdenum (Mo) green compact with which Copper (Cu) of 20-60 wt % is impregnated. It is preferable that the heat sink substrate is a rolled plate obtained by repeatedly warm rolling or cold rolling the Cu—Mo composite substrate and that the rolled plate does not include any fine void and unevenly impregnated copper, that is, copper and molybdenum are uniformly distributed therein.