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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6271585 B1

PDFFull Text
Date of Patent:
Aug. 07, 2001

Filed:

Jul. 07, 1998

Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same

Applicant:
Inventors:

Mitsuo Osada, Yamagata, JP;

Akira Ichida, Toyama, JP;

Norio Hirayama, Yamagata, JP;

Kiyoshi Asai, Yamagata, JP;

Hidetoshi Maesato, Yamagata, JP;

Tadashi Arikawa, Toyama, JP;

Assignee:

Tokyo Tungsten Co., Ltd., Tokyo, JP;

Attorney:

Sughrue, Mion, Zinn, Macpeak & Seas, PLLC

Primary Examiner:

Sara Crane

Int. Cl.
CPC ...
H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/334 ;
Abstract

A heat sink substrate comprises a Cu—Mo composite substrate composed of a molybdenum (Mo) green compact with which Copper (Cu) of 20-60 wt % is impregnated. It is preferable that the heat sink substrate is a rolled plate obtained by repeatedly warm rolling or cold rolling the Cu—Mo composite substrate and that the rolled plate does not include any fine void and unevenly impregnated copper, that is, copper and molybdenum are uniformly distributed therein.

Find Patent Forward Citations

Osada, Mitsuo. (2001). Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same (U.S. Patent No. 6271585). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6271585

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