Minoru Sugiura

Title: Minoru Sugiura: Innovator in Semiconductor Adhesives

Introduction

Minoru Sugiura is a notable inventor based in Tsuchiura, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the development of advanced adhesive materials. With a total of four patents to his name, Sugiura's work focuses on enhancing the performance and reliability of semiconductor devices.

Latest Patents

Sugiura's latest patents include innovations such as a film-like adhesive, an adhesive sheet, and a semiconductor device utilizing these materials. The primary objective of his film-like adhesive is to achieve an exceptional combination of processability and reflow resistance. This adhesive is specifically designed for bonding semiconductor elements to adherents and comprises an adhesive layer made from a selection of resins, including polyurethaneimide resins, polyurethaneamideimide resins, and polyurethaneimide-polyurethaneamideimide resins. Additionally, he has developed a die bonding resin paste that includes a polyurethaneimide resin, a thermosetting resin, a filler, and a printing solvent, aimed at improving the manufacturing process of semiconductor devices.

Career Highlights

Minoru Sugiura is currently associated with Hitachi Chemical Company, Ltd., where he continues to innovate in the field of adhesive technologies. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.

Collaborations

Sugiura has collaborated with esteemed colleagues such as Haruhiko Kikkawa and Fumio Kataoka, contributing to the collective knowledge and advancements in semiconductor technology.

Conclusion

Minoru Sugiura's contributions to the field of semiconductor adhesives highlight his innovative spirit and dedication to improving technology. His patents reflect a commitment to enhancing the performance of semiconductor devices, making a lasting impact in the industry.