The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2012
Filed:
Sep. 28, 2007
Applicants:
Syuichi Mori, Hitachi, JP;
Yuji Hasegawa, Hitachi, JP;
Minoru Sugiura, Tsukuba, JP;
Inventors:
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/50 (2006.01); C09J 175/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
The die bonding resin paste of the invention comprises a polyurethaneimide resin represented by the following general formula (I), a thermosetting resin, a filler and a printing solvent. [wherein R1 represents a divalent organic group containing an aromatic ring or aliphatic ring, R2 represents a divalent organic group with a molecular weight of 100-10,000, R3 represents a tetravalent organic group containing 4 or more carbon atoms, and n and m each independently represent an integer of 1-100.]