Hitachi Chemical Company, Ltd.

Minoru Sugiura

Jun Tanaka

Makoto Kaji

Fumio Kataoka

Issei Takemoto

Keiko Isoda

Haruhiko Kikkawa

Shunichiro Uchimura

Takashi Masuko

Masami Yusa

Shigeki Katogi

Syuichi Mori

Yuji Hasegawa

An object of the present invention is to provide a film-like adhesive capable of achieving a superior combination of processability and reflow resistance. A film-like adhesive of the present invention is used for bonding a semiconductor element to an adherend, and includes an adhesive layer comprising at least one resin selected from the group consisting of polyurethaneimide resins, polyurethaneamideimide resins and polyurethaneimide-polyurethaneamideimide resins.

Film-like adhesive, adhesive sheet, and semiconductor device using same

The die bonding resin paste of the invention comprises a polyurethaneimide resin represented by the following general formula (I), a thermosetting resin, a filler and a printing solvent. [wherein R1 represents a divalent organic group containing an aromatic ring or aliphatic ring, R2 represents a divalent organic group with a molecular weight of 100-10,000, R3 represents a tetravalent organic group containing 4 or more carbon atoms, and n and m each independently represent an integer of 1-100.]

Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste

A polyimide precursor having repeating units of the formula:

Photosensitive polyimide precursor and its use for pattern formation

A polyimide precursor having repeating units of the formula: ##STR1## wherein R.sup.1 is a tetravalent organic group having 4 or more carbon atoms; R.sup.2 is a trivalent or tetravalent organic group having one or more aromatic rings; R.sup.3 is a monovalent organic group; A is a monovalent group showing acidity; and n is an integer of 1 or 2, is effective for preparing a highly sensitive negative-working photosensitive material developable with an alkaline aqueous solution in a short time with high resolution.

Photosensitve polymide precursor and its use for pattern formation

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Tsuchiura, Japan

Minoru Sugiura