The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Aug. 04, 2006
Applicants:
Takashi Masuko, Tsukuba, JP;
Minoru Sugiura, Tsuchiura, JP;
Shigeki Katogi, Chikusei, JP;
Masami Yusa, Chikusei, JP;
Inventors:
Takashi Masuko, Tsukuba, JP;
Minoru Sugiura, Tsuchiura, JP;
Shigeki Katogi, Chikusei, JP;
Masami Yusa, Chikusei, JP;
Assignee:
Hitachi Chemical Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08L 75/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
An object of the present invention is to provide a film-like adhesive capable of achieving a superior combination of processability and reflow resistance. A film-like adhesive of the present invention is used for bonding a semiconductor element to an adherend, and includes an adhesive layer comprising at least one resin selected from the group consisting of polyurethaneimide resins, polyurethaneamideimide resins and polyurethaneimide-polyurethaneamideimide resins.