logo

For the Inventor, By the Inventor

San Jose, CA, United States of America

Ming Xia

This inventor holds 25 USPTO granted patents and 1 published patent application and 14 EPO patents, primarily in Optical Networking. Top assignees: Telefonaktiebolaget Lm Ericsson (Publ), Applied Materials, Inc., Microsoft Technology Licensing, LLC. Active years: 2014-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming Xia. Retrieved from https://idiyas.com/inventor/ming-xia

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 

% Patents Active = 76.0

 

Average Co-Inventor Count = 3.4

ph-index = 8

Forward Citations = 113(Granted Patents)


Location History:

  • Milpitas, CA (US) (2014 - 2017)
  • Sunnyvale, CA (US) (2019 - 2021)
  • San Jose, CA (US) (2016 - 2022)

Company Filing History:

goldMedal21 out of 26,974 
 
Telefonaktiebolaget Lm Ericsson (Publ)
 patents
silverMedal3 out of 14,433 
 
Applied Materials, Inc.
 patents
bronzeMedal1 out of 56,215 
 
Microsoft Technology Licensing, LLC
 patents

Years Active: 2014-2022

Loading Chart...
Loading Chart...
Areas of Expertise:
Selective Material Removal
Plasma Etch Processes
Distributed Storage Systems
Service Function Placement
Machine Learning
SDN Networks
Optical Network
Network Function Placement
Wavelength Division Multiplexing
Spectral Use
Topology Discovery
Packet Marking
25 patents (USPTO):Explore Patents
1. 11417534 - Selective material removal (2022-08-16),
2. 11101136 - Process window widening using coated parts in plasma etch processes (2021-08-24),
3. 10445208 - Tunable, efficient monitoring of capacity usage in distributed storage systems (2019-10-15),
4. 10432512 - Packet marking for L4-7 advanced counting and monitoring (2019-10-01),
5. 10419530 - System and methods for intelligent service function placement and autoscale based on machine learning (2019-09-17),
6. 10297458 - Process window widening using coated parts in plasma etch processes (2019-05-21),
7. 10182276 - Method and management node for deciding ports suitable to be communicatively connected to each other in a communications network (2019-01-15),
8. 10027530 - System and method for troubleshooting SDN networks using flow statistics (2018-07-17),
9. 9912788 - Systems and methods of an enhanced state-aware proxy device (2018-03-06),
10. 9860152 - Non-intrusive method for testing and profiling network service functions (2018-01-02),
11. 9853877 - Method for optimized placement of service-chain-monitoring probes (2017-12-26),
12. 9843486 - System and method for SLA violation mitigation via multi-level thresholds (2017-12-12),
13. 9769065 - Packet marking for L4-7 advanced counting and monitoring (2017-09-19),
14. 9660756 - Method for split spectrum signalling in an optical network (2017-05-23),
15. 9628380 - Method and system for routing a network function chain (2017-04-18),

Title: Inventor Ming Xia: Revolutionizing Technology in San Jose

Introduction: Ming Xia is a visionary inventor based in San Jose, CA, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Ming Xia holds several patents in the areas of artificial intelligence, machine learning, and robotics, showcasing his commitment to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Ming Xia has worked with leading tech companies in Silicon Valley, spearheading projects that have revolutionized industries and paved the way for future innovations.

Collaborations: Ming Xia has collaborated with top researchers, engineers, and scientists from renowned institutions and companies worldwide, fostering a culture of innovation and knowledge sharing.

Conclusion: Ming Xia's relentless pursuit of innovation and his passion for creating cutting-edge technologies continue to inspire the next generation of inventors and shape the future of the tech industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…