The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Aug. 07, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Dongqing Yang, Pleasanton, CA (US);

Tien Fak Tan, Campbell, CA (US);

Peter Hillman, Santa Clara, CA (US);

Lala Zhu, Fremont, CA (US);

Nitin K. Ingle, San Jose, CA (US);

Dmitry Lubomirsky, Cupertino, CA (US);

Christopher Snedigar, Hayward, CA (US);

Ming Xia, Sunnyvale, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/3065 (2006.01); H01J 37/32 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3065 (2013.01); H01J 37/3244 (2013.01); H01J 37/32467 (2013.01); H01L 21/02123 (2013.01); H01L 21/02164 (2013.01); H01L 21/02315 (2013.01); H01L 21/31053 (2013.01);
Abstract

Embodiments of the present technology may include a method of etching. The method may include mixing plasma effluents with a gas in a first section of a chamber to form a first mixture. The method may also include flowing the first mixture to a substrate in a second section of the chamber. The first section and the second section may include nickel plated material. The method may further include reacting the first mixture with the substrate to etch a first layer selectively over a second layer. In addition, the method may include forming a second mixture including products from reacting the first mixture with the substrate.


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