Hsinchu, Taiwan

Ming-Hwei Perng

This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignees: National Tsing Hua University, Test Research, Inc., Other. Active years: 2009-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming-Hwei Perng. Retrieved from https://idiyas.com/inventor/ming-hwei-perng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 66.7

Average Co-Inventor Count = 1.9

ph-index = 2

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2009-2014

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3 patents (USPTO):Explore Patents

Title: Innovations of Ming-Hwei Perng

Introduction

Ming-Hwei Perng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of technology, particularly in the development of automatic search systems and methods for measuring material thickness. With a total of 3 patents, his work showcases a blend of creativity and technical expertise.

Latest Patents

One of his latest patents is an "Automatic search system and method." This invention provides an automatic search system that assists a mobile apparatus in searching for a matching device. The method involves capturing N sets of consecutive images at different time points as the mobile apparatus moves. By comparing image features, the system determines if a matching device exists and generates signals to control the mobile apparatus accordingly.

Another significant patent is the "Method for thickness calibration and measuring thickness of material." This method measures the thickness of a first absorbing material in the presence of a second absorbing material. It involves fixing the thickness of the first material while varying the second to create a calibration standard. The intensity of transmissive energy is detected to calculate the unknown thickness of the first material.

Career Highlights

Ming-Hwei Perng has worked with Test Research, Inc., where he applied his innovative ideas to real-world applications. His experience in the industry has allowed him to refine his skills and contribute to various technological advancements.

Collaborations

He has collaborated with notable individuals such as Wen-Yang Chiang and Wen-Yih Isaac Tseng. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Ming-Hwei Perng's contributions to technology through his patents reflect his dedication to innovation. His work in automatic search systems and material thickness measurement demonstrates the impact of his inventions on the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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