Zhubei, Taiwan

Ming-Hsien Lee

This inventor holds 4 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2018-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming-Hsien Lee. Retrieved from https://idiyas.com/inventor/ming-hsien-lee-00vyn84u

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2018-2021

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4 patents (USPTO):Explore Patents

Title: The Innovations of Ming-Hsien Lee

Introduction

Ming-Hsien Lee is a prominent inventor based in Zhubei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on improving the efficiency and functionality of wafer cassette systems, which are crucial in semiconductor manufacturing.

Latest Patents

Ming-Hsien Lee's latest patents include innovative designs for adaptive insets used in wafer cassette systems. One of his notable patents describes a method of transporting a semiconductor wafer. This method involves transferring a semiconductor wafer into a first wafer slot of a second plurality of wafer slots within an adaptive inset. The adaptive inset is arranged within an interior cavity of a wafer cassette, which has a first plurality of wafer slots. This design allows for efficient transportation of the wafer into a loading port of a semiconductor processing tool, which is configured to perform fabrication processes on the semiconductor wafer. Another patent focuses on the wafer cassette system itself, which includes a wafer cassette with a first plurality of wafer slots having a first width. The adaptive inset, fastened to the wafer cassette, features a second plurality of wafer slots with a second width that is less than the first width. This configuration is designed to receive a substrate after the adaptive inset has been secured to the wafer cassette.

Career Highlights

Ming-Hsien Lee is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing the technology used in wafer handling and processing.

Collaborations

Ming-Hsien Lee has collaborated with notable colleagues, including Hung-Jen Lu and Chia-Yuan Chen. Their combined expertise has contributed to the development of innovative solutions in semiconductor manufacturing.

Conclusion

Ming-Hsien Lee's contributions to the field of semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the efficiency of semiconductor manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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