The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Jun. 08, 2016
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Hung-Jen Lu, Hsinchu, TW;
Ming-Hsien Lee, Zhubei, TW;
Chih-Hung Huang, Tainan, TW;
Chuan-Pu Chen, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/673 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67369 (2013.01); H01L 21/6732 (2013.01);
Abstract
A wafer container is provided. The wafer container includes a pod base having a top surface and a bottom surface, a cassette disposed on the top surface, and a damping device, disposed on the bottom surface. The damping device includes a housing disposed in the pod base, and a damping mechanism disposed in the housing and protruding over the bottom surface. The damping mechanism is configured to provide a damping force.