The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Oct. 17, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Chia-Yuan Chen, Hsinchu, TW;

Hung-Jen Lu, Hsinchu, TW;

Ming-Hsien Lee, Zhubei, TW;

Po-Tao Chu, New Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/673 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67386 (2013.01);
Abstract

The present disclosure, in some embodiments, relates to a method of transporting a semiconductor wafer. The method includes transferring a semiconductor wafer into a first wafer slot of a second plurality of wafer slots within an adaptive inset. The adaptive inset is arranged within an interior cavity of a wafer cassette having a first plurality of wafer slots while transferring the semiconductor wafer into the first wafer slot. The wafer cassette and the adaptive inset are transported into a loading port of a semiconductor processing tool configured to perform a fabrication process on the semiconductor wafer.


Find Patent Forward Citations

Loading…