Company Filing History:
Years Active: 2012-2022
Title: Mincent Lee: Innovator in Semiconductor Technology
Introduction
Mincent Lee is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on innovative techniques for evaluating semiconductor structures, particularly in the context of misalignment issues.
Latest Patents
One of Mincent Lee's latest patents is titled "Alignment Testing for Tiered Semiconductor Structure." This patent provides various techniques and systems for assessing a tiered semiconductor structure, such as a stacked CMOS structure, for misalignment. In one embodiment, a connectivity test is conducted on vias between a first layer and a second layer to determine the via diameter and via offset, which are crucial for evaluating misalignment. Additionally, a connectivity test for vias within a first layer is performed to ascertain an alignment rotation based on the connections made through a conductive arc within a second layer or to a conductive pattern from a set of conductive patterns. This innovative approach allows for the evaluation of the tiered semiconductor structure during a stacked CMOS process.
Career Highlights
Mincent Lee has worked with notable organizations, including Taiwan Semiconductor Manufacturing Company Ltd. and Tsinghua University. His experience in these esteemed institutions has allowed him to refine his expertise in semiconductor technology and contribute to groundbreaking advancements in the field.
Collaborations
Throughout his career, Mincent Lee has collaborated with esteemed colleagues such as Mill-Jer Wang and Ching-Nen Peng. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Mincent Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in the evaluation of semiconductor structures, paving the way for future innovations.