Hsinchu, Taiwan

Min-Hsun Hsieh

This inventor holds 233 USPTO granted patents and 47 published patent applications and 6 EPO patents, primarily in Light-Emitting Devices (CPC class H01L33-62). Top assignees: Epistar Corporation, Yenrich Technology Corporation, Ennostar Corporation. Active years: 2001-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Min-Hsun Hsieh. Retrieved from https://idiyas.com/inventor/min-hsun-hsieh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 233 

% Patents Active = 92.7

 

Average Co-Inventor Count = 3.0

ph-index = 18

Forward Citations = 1,206(Granted Patents)

Forward Citations (Not Self Cited) = 1,128(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Hsieh, TW (2010)
  • Hs, TW (2020)
  • Hsinchu, TW (2001 - 2024)

Company Filing History:


Years Active: 2001-2026

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Areas of Expertise:
Light-Emitting Device
Display Module
Manufacturing Method
Semiconductor Component
Chip Transferring Method
Die Bonding
Light-Emitting Bulb
Display Device
Repairing Method
Energy Beam
Light-Emitting Apparatus
Processing Method
233 patents (USPTO):Explore Patents

Title: Min-Hsun Hsieh: A Prolific Inventor and Innovator

Introduction:

In the field of inventions and technological advancements, there are individuals whose contributions are truly remarkable. Min-Hsun Hsieh, hailing from Hsinchu, Taiwan, is one such inventor. With an impressive track record of 199 patents, Hsieh has made significant contributions to the world of technology. This article explores his latest patents, career highlights, and notable collaborations, shedding light on his outstanding achievements.

Latest Patents:

Among Min-Hsun Hsieh's recent patents is a groundbreaking "Method and Structure for Die Bonding using Energy Beam." This method revolutionizes die-bonding processes by joining multiple semiconductor elements with a target substrate utilizing energy beams. The innovative technique helps avoid warpage of PCB (Printed Circuit Board) while ensuring a high bonding strength between the semiconductor elements and the target substrate's circuit structure.

Another notable patent from Hsieh is the "Light-emitting Device, Manufacturing Method Thereof, and Display Module Using the Same." This invention focuses on a light-emitting device with a unique supporting structure, designed to maximize its width-to-thickness ratio. By enhancing the structural design, Hsieh addresses the efficiency and performance of light-emitting devices, contributing to advancements in the display industry.

Career Highlights:

During his career, Min-Hsun Hsieh has worked with renowned companies such as Epistar Corporation, a leading global manufacturer of optoelectronic technology, and Yenrich Technology Corporation. Through his involvement with these organizations, Hsieh has demonstrated his ability to apply cutting-edge concepts and bring innovative ideas to fruition.

Collaborations:

Collaboration plays a crucial role in the world of inventions and patents, and Min-Hsun Hsieh has been fortunate to work with esteemed individuals throughout his career. Notably, he has collaborated with Chih-Chiang Lu and Chien-Yuan Wang, fellow experts in their respective fields. Together, they have contributed to groundbreaking advancements in semiconductor technology and light-emitting devices, leaving a lasting impact on the industry.

Conclusion:

Min-Hsun Hsieh's notable achievements and extensive patent portfolio reflect his incredible talent for innovation and inventiveness. His groundbreaking patents, such as the die-bonding method and the light-emitting device with an optimized supporting structure, underscore his ability to address critical challenges in the field. Through his collaborations and employment with prominent companies, Hsieh has been instrumental in driving technological advancements. As we look to the future, it is evident that his contributions will continue to shape the landscape of innovations and patents, leaving a lasting impact on the industry as a whole.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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